歡迎來到逢甲大學材料科學與工程學系沈育安實驗室。本實驗室聚焦於金屬材料、電子材料與奈米尺度固態材料之設計、製備與分析，並進一步應用於先進電子封裝與半導體異質整合技術。研究內容涵蓋低溫接合材料、金屬薄膜、界面反應、擴散行為、微結構演化與材料可靠度等主題。在研究過程中，本實驗室重視材料基礎科學與工程應用之結合，常用之核心知識包括物理冶金、材料熱力學、擴散理論與材料機械性質。主要使用之分析與測試技術包含 X-ray 繞射分析（XRD）、掃描式電子顯微鏡（SEM）、背向散射電子繞射分析（EBSD）、電子微探分析儀（EPMA）、穿透式電子顯微鏡（TEM）以及微拉伸與機械性質測試等。本實驗室的最終目標，是培養具備金屬材料基礎、先進電子封裝知識、微結構分析能力與工程問題解決能力之研究人才，使學生未來能投入金屬材料、電子封裝與先進半導體相關產業與學術研究。

Welcome to the Yu-An Shen Laboratory in the Department of Materials Science and Engineering at Feng Chia University. Our laboratory focuses on the design, processing, and characterization of solid-state materials, including metallic, electronic, and nanoscale materials, with particular emphasis on their applications in advanced electronic packaging and semiconductor heterogeneous integration. Our research topics include low-temperature bonding materials, metallic thin films, interfacial reactions, diffusion behavior, microstructural evolution, and materials reliability. We place strong emphasis on the integration of fundamental materials science and engineering applications. The core scientific principles frequently used in our research include physical metallurgy, materials thermodynamics, diffusion, and mechanical properties of materials. The major characterization and testing techniques used in our laboratory include X-ray diffraction (XRD), scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), electron probe microanalysis (EPMA), transmission electron microscopy (TEM), and micro-tensile/mechanical testing. The ultimate goal of our laboratory is to train students to become researchers and engineers with solid knowledge in metallic materials, advanced electronic packaging, microstructural characterization, and engineering problem-solving. Through these training experiences, students are expected to contribute to the fields of metallic materials, electronic packaging, and advanced semiconductor technologies.