歡迎來到逢甲材料沈育安實驗室。本實驗室著重於金屬、電子及奈米等固態材料的發展，進而應用在先進電子封裝技術上。研究中，最常使用到的材料基礎科學為物理冶金、材料熱力學、擴散以及材料機械性質，而會使用到的儀器為X-ray繞射分析(XRD)、掃描式電子顯微鏡(SEM)、背向散射電子繞射儀(EBSD)、電子微探分析儀(EPMA)以及穿透式電子顯微鏡 (TEM)、微拉伸試驗機。最終目的為培養金屬及先進半導體封裝的人才。

We focus on the development of solid materials such as metallic, electronic, and nano-scale materials, and then apply to advanced electronic packaging technology. The commonly used fundamental material science in the studies are physical metallurgy, thermodynamics of materials, materials diffusion, and mechanical properties of materials. The instruments used are X-ray diffraction (XRD), scanning electron microscopy (SEM), electron backscattered diffraction (EBSD), electron probe microanalyzer (EPMA), and transmission electron microscopy (TEM), and universal testing machine. The ultimate purpose is to train the students to become researchers and engineers of metal and advanced semiconductor packaging.