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PUBLICATIONS

Total : 45, (逢甲: 25), EI: 4

  1. Andromeda Dwi Laksono, Yu-An Shen, Ting Chen, and Yee-Wen Yen*, Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder, JOM, (2024), https://doi.org/10.1007/s11837-024-06426-4.

  2. Siliang He, Jian Jiang, Yu-An Shen, Lanqing Mo, Yuhao Bi, Junke Wu, and Chan Guo*, Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at a  Low Temperature, Materials, (2024), https://doi.org/10.3390/ma17051055. (Special Issue Editor)

  3. Yu-An Shen*, Effect of Indium Addition on Mechanical, Thermal, and Soldering Properties of Eutectic Sn–9Zn Alloy, Materials Chemistry and Physics, (2024), https://doi.org/10.1016/j.matchemphys.2024.128992

  4. Jia-Yi Lee, Yu-An Shen*, Chih-Ming Chen*, Void-Free Interface between In and High-Impurity Cu Joint, Science and Technology of Welding and Joining, (2023), 10.1080/13621718.2023.2259720. (SCI)

  5. Xiong, Bifu; He, Siliang*; Ge, Jinguo; Li, Quantong; Hu, Chuan; Yan, Haidong; Shen, Yu-An*, "Cu-Cu Joint with Sn-58Bi/Porous Cu/Sn-58Bi Transient Liquid Phase Bonding under Formic Acid Atmosphere," Soldering and Surface Mount Technology, (2023), DOI: 10.1108/SSMT-07-2023-0034. (SCI)

  6. Siliang He, Bifu Xiong, Fangyi Xu, Biyang Chen, Yinhua Cui, Chuan Hu, Gao Yue* and Yu-An Shen*, Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere, Materials, (2023), https://doi.org/10.3390/ma16062389.

  7. Yu-An Shen*, "Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Aging," JOM, (2023), https://doi.org/10.1007/s11837-023-06079-9. (SCI)

  8. Yu-An Shen*, Yun-Xuan Lin, Fan-Yi Ouyang*, Hiroshi Nishikawa, Ming-Hung Tsai, Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy", Intermetallics, (2023), https://doi.org/10.1016/j.intermet.2023.107821. (SCI)

  9. Siliang He, Bifu Xiong, Fangyi Xu, Biyang Chen, Yinhua Cui, Chuan Hu, Gao Yue* and Yu-An Shen*, Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere," (2023), Materials, https://doi.org/10.3390/ma16062389. (SCI)

  10. Yu-Jyun Kao, Yu-Ju Li, Yu-An Shen* & Chih-Ming Chen*, "Significant Hall–Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration," Scientific Reports, (2023), https://doi.org/10.1038/s41598-023-27669-2. (SCI)

  11. Siliang He#,*, Yu-An Shen#, Bifu Xiong, Fupeng Huo, Jiahui Li, Jinguo Ge, Zhiliang Pan, Wangyun Li, Chuan Hu, Hiroshi Nishikawa, "Behavior of Sn-3.0Ag-0.5Cu Solder/Cu Fluxless Soldering via Sn Steaming under Formic Acid Atmosphere," Journal of Materials Research and Technology-JMR&T (2022), https://doi.org/10.1016/j.jmrt.2022.10.056. (SCI)

  12. Siliang He*, Yuhao Bi, Yu-An Shen, Zhikuan Chen, Gao Yue*, Chuan Hu, Hiroshi Nishikawa, "Contact Angle Analysis and Intermetallic Compounds Formation Between Solders and Substrates under Formic acid Atmosphere," Journal of Advanced Joining Processes, (2022), https://doi.org/10.1016/j.jajp.2022.100118. (EI)

  13. Yu-An Shen* and John A. Wu, "Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints," Materials (2022), https://doi.org/10.3390/ma15145086. (SCI)

  14. Yu-An Shen*, Xiu-Mei Yang#, Cheng-Yu Tsai#, Yu-Hung Ouyang, Ming-Hung Tsai, Tao-Tsung Shun, "Effect of Cu on the Interfacial Reaction Between Sn-based Solders and FeCoNiCu Alloys," Intermetallics (2022), https://doi.org/10.1016/j.intermet.2022.107530. (SCI)

  15. Yu-An Shen*, Hao-Zhe Chen, Sheng-Wen Chen, Sheng-Kuei Chiu, Xing-You Guo, Ya-Ping Hsieh, "Graphene as a Diffusion Barrier at the Interface of Liquid-State Low-Melting Sn–58Bi Alloy and Copper Foil," Applied Surface Science (2022), https://doi.org/10.1016/j.apsusc.2021.152108, 2022-03. (SCI)

  16. Duy Le Han, Yu-An Shen, Fupeng Huo, Hiroshi Nishikawa, "Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints, " Metal (2021), https://doi.org/10.3390/met12010033, 2021-12. (SCI)

  17. F. Huo, Yu-An Shen, S. He, K. Zhang, H. Nishikawa, "Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method," Vacuum (2021), https://doi.org/10.1016/j.vacuum.2021.110370, 2021-09. (SCI)

  18. Yu-An Shen*, Sheng-Wen Chen, Hao-Zhe Chen, Chun-Ming Chang, Yu-Hong Ouyang, "Extremely Thin Interlayer of Multi-Element Intermetallic Compound between Sn-Based Solders and FeCoNiMn High-Entropy Alloy," Applied Surface Science (2021), https://doi.org/10.1016/j.apsusc.2021.149945, 2021-08. (SCI)

  19. Zhi Jin*, Yu-An Shen, Yang Zuo, Y.C. Chan, S.H. Mannan, Hiroshi Nishikawa, "Observation of Void Formation Patterns in SnAg Films undergoing Electromigration and Simulation using Random Walk Methods," Scientific Reports (2021), https://doi.org/10.1038/s41598-021-88122-w, 2021-04. (SCI)

  20. Ping-Chen Chiang, Yu-An Shen*, Chih-Ming Chen*, "Effects of Impurities on Void Formation at the Interface between Sn-3.0Ag-0.5Cu and Cu Electroplated Films," Journal of Materials Science: Materials in Electronics (2021), 10.1007/s10854-021-05824-7, 2021-03. (SCI)

  21. Zhi Jin*, Yu-An Shen*, Fupeng Huo, Y.C. Chan, Hiroshi Nishikawa*, "Electromigration Behavior of Silver Thin Film Fabricated by Electron-Beam Physical Vapor Deposition," Journal of Materials Science (2021), https://doi.org/10.1007/s10853-021-05862-w, 2021-02. (SCI)​

  22. Yu-An Shen*, Han-Ming Hsieh, Shih-Hsun Chen, Jiahui Li, Sheng-Wen Chen, Hiroshi Nishikawa, "Investigation of FeCoNiCu properties: thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound," Applied Surface Science (2021), https://doi.org/10.1016/j.apsusc.2021.148931, 2021-01. (SCI)​

  23. Duy Le Han, Yu-An Shen, Siliang He, and Hiroshi Nishikawa, "Effect of Cu addition on the microstructure and mechanical properties of In-Sn-based low-temperature alloy," Materials Science & Engineering A (2021), https://doi.org/10.1016/j.msea.2021.140785, 2021-01. (SCI)​

  24. P.C. Chiang, Yu-An Shen*, S.P. Feng and Chih-Ming Chen*, "Electrodeposition of twinned Cu with strong texture effect on voiding propensity in electroplated Cu solder joints," Journal of The Electrochemical Society (2021), https://doi.org/10.1149/1945-7111/abd517, 2020-12. (SCI)​

  25. Runhua Gao, Yu-An Shen, Jiahui Li, Siliang He, Hiroshi Nishikawa, "Mechanical and Microstructural Enhancements of Ag Microparticle Sintered Joint by Ultrasonic Vibration," Journal of Materials Science: Materials in Electronics (2020), https://doi.org/10.1007/s10854-020-04684-x, 2020-10. (SCI)​

  26. Runhua Gao; Siliang He; Jiahui Li; Yu-An Shen; Hiroshi Nishikawa, "Interfacial Transformation of Preoxidized Cu Microparticles in a Formic-acid Atmosphere for Pressureless Cu-Cu Bonding," Journal of Materials Science: Materials in Electronics (IF: 2.478), https://doi.org/10.1007/s10854-020-04026-x, 2020-08. (SCI)​

  27. Duy Le Han, Yu-An Shen, Sanghun Jin, Hiroshi Nishikawa, "Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy," Journal of Materials Science (IF: 4.220), https://doi.org/10.1007/s10853-020-04691-7, 2020-04. (SCI)​

  28. Siliang He, Runhua Gao, Yu-An Shen, Jiahui Li, Hiroshi Nishikawa, "Wettability, interfacial reactions, and impact strength of Sn–3.0 Ag–0.5 Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere," Journal of Materials Science (IF: 4.220), 55, 3107-3117, 2020-03. (SCI)​

  29. Tien-Lin Lu, Yu-An Shen, John A Wu, Chih Chen, "Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition," Materials (IF: 3.623), 13(1), 134, 2020-01. (SCI)​

  30. Siliang He, Runhua Gao, Jiahui Li, Yu-An Shen, Hiroshi Nishikawa, "In-situ observation of fluxless soldering of Sn-3.0 Ag-0.5 Cu/Cu under a formic acid atmosphere," Materials Chemistry and Physics (IF: 4.094), 239, 122309, 2020-01. (SCI)​

  31. Yu-An Shen*, Shiqi Zhou, Jiahui Li, Chih-han Yang, Sijie Huang, Shih-kang Lin, Hiroshi Nishikawa, "Sn-3.0 Ag-0.5 Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology," Materials & Design (IF: 7.991), 183, 108144, 2019-12. (SCI)​

  32. Zhi Jin#, Yu-An Shen#, Siliang He, Shiqi Zhou, YC Chan, Hiroshi Nishikawa, "Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0 Ag-0.5 Cu/Cu solder joints," Journal of Applied Physics, 126(18), 185109, 2019-11. (SCI)​

  33. Yu-An Shen*, Chun-Ming Lin, Jiahui Li, Runhua Gao, Hiroshi Nishikawa, "Suppressed Growth of (Fe, Cr, Co, Ni, Cu) Sn 2 Intermetallic Compound at Interface between Sn-3.0 Ag-0.5 Cu Solder and FeCoNiCrCu 0.5 Substrate during Solid-state Aging," Scientific reports, 9, 10210, 2019-07. (SCI)​

  34. Yu-An Shen*, Shiqi Zhou, Hiroshi Nishikawa, "Preferred orientation of Bi and effect of Sn-Bi microstructure on mechanical and thermomechanical properties in eutectic Sn-Bi alloy," Materialia, 6, 100309, 2019-06. (SCI)​

  35. Shiqi Zhou, Chih-han Yang, Yu-An Shen, Shih-kang Lin, Hiroshi Nishikawa, "The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength," Materialia, 6, 100300, 2019-06. (SCI)​

  36. Shiqi Zhou, Yu-An Shen, Tiffani Uresti, Vasanth Shunmugasamy, Bilal Mansoor, Hiroshi Nishikawa, "Effects of In and Zn Double Addition on Eutectic Sn-58Bi Alloy," 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1081-1086, 2019-05. (EI)​

  37. Yu-An Shen*, Shiqi Zhou, Jiahui Li, KN Tu, Hiroshi Nishikawa, "Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints During Thermomigration," 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2003-2008, 2019-05. (EI)​

  38. Runhua Gao, Jiahui Li, Yu-An Shen, Hiroshi Nishikawa, "A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere," 2019 International Conference on Electronics Packaging (ICEP), 159-162, 2019-04. (EI)​

  39. Shiqi Zhou, Chih-han Yang, Yu-An Shen, Shih-kang Lin, Hiroshi Nishikawa, "The study of Sn-45Bi-2.6 Zn alloy before and after thermal aging," 2019 International Conference on Electronics Packaging (ICEP), 333-336, 2019-04. (EI)​

  40. Runhua Gao, Siliang He, Yu-An Shen, Hiroshi Nishikawa, "Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles," Journal of Electronic Materials, 48(4), 2263–2271, 2019-04. (SCI)​

  41. Yu-An Shen*, Chun-Ming Lin, Jiahui Li, Siliang He, Hiroshi Nishikawa, "Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder," Scientific Reports, 9, 3658, 2019-03. (SCI)​

  42. Shiqi Zhou, Yu-An Shen, Tiffani Uresti, Vasanth C. Shunmugasamy, Bilal Mansoor, Hiroshi Nishikawa, "Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy," Journal of Materials Science: Materials in Electronics, https://link.springer.com/article/10.1007/s10854-019-01056-y, 2019-03. (SCI)​

  43. Yu-An Shen*, Shiqi Zhou, Jiahui Li, K.N. Tu, Hiroshi Nishikawa, "Thermomigration induced microstructure and property changes in Sn-58Bi solders," Materials & Design (IF: 7.991), 166, 107619, 2019-03. (SCI)​

  44. Yu-An Shen, Fan-Yi Ouyang, Chih Chen, "Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps," Materials Letters, 3.204, 2019-02. (SCI)​

  45. Yu-An Shen, Chih Chen, "Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration," Scripta Materialia, 128, 6-9, 2017-02. (SCI)

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